概要: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
関連製品特性:
12V9 cup wheel shape for precision grinding applications.
150mm outer diameter (D) and 20mm thickness (T) for versatile use.
31.75mm inner hole diameter (H) ensures compatibility with standard machines.
10mm abrasive width (W) for precise material removal.
D30 ダイヤモンド磨砂砂 (G) は超高硬さと耐磨性を提供します.
C125 diamond concentration (C) for optimal performance.
Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
特定の要求を満たすために利用可能なカスタマイズ可能なサイズ.
FAQ:
12V9 樹脂結合ダイヤモンド磨き機は どんな材料を処理できるのか?
この研削砥石は、超硬工具、セラミック部品、半導体材料の加工に最適です。
What machine tools are compatible with this grinding wheel?
It is suitable for use with tool grinders and cylindrical grinders.
Can the grinding wheel be customized to different sizes?
Yes, we offer customization for other sizes based on your specific requirements.