12V9 150*20*31.75*10mm D30 C125 樹脂結合ダイヤモンドホイール

樹脂の結束のダイヤモンドの粉砕車輪
April 18, 2025
カテゴリー接続: 樹脂のとらわれの粉砕車輪
概要: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
関連製品特性:
  • 12V9 cup wheel shape for precision grinding applications.
  • 150mm outer diameter (D) and 20mm thickness (T) for versatile use.
  • 31.75mm inner hole diameter (H) ensures compatibility with standard machines.
  • 10mm abrasive width (W) for precise material removal.
  • D30 ダイヤモンド磨砂砂 (G) は超高硬さと耐磨性を提供します.
  • C125 diamond concentration (C) for optimal performance.
  • Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
  • 特定の要求を満たすために利用可能なカスタマイズ可能なサイズ.
FAQ:
  • 12V9 樹脂結合ダイヤモンド磨き機は どんな材料を処理できるのか?
    この研削砥石は、超硬工具、セラミック部品、半導体材料の加工に最適です。
  • What machine tools are compatible with this grinding wheel?
    It is suitable for use with tool grinders and cylindrical grinders.
  • Can the grinding wheel be customized to different sizes?
    Yes, we offer customization for other sizes based on your specific requirements.