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Resin Bond Diamond Grinding Wheel 4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools

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Resin Bond Diamond Grinding Wheel  4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools
特徴 ギャラリー 製品の説明 見積依頼
特徴
仕様
形: ディスクタイプ
使用法: 研削
とらわれの代理店: 樹脂
配達: エクスプレスによって
パッケージ: カートンボックス
HSコード: 6804211000
研摩剤: ダイヤモンド
応用: 超硬合金
直径: 150mm
厚さ: 14mm
内側の穴: 20mm
アブラシブ幅: 5mm
粒度: D64
アブラシブ深さ: 2mm
基本材料: アルミニウム
ハイライト:

resin bond diamond grinding wheel for carbide tools

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4A2 diamond grinding wheel D64 C100

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150mm resin bond grinding wheel with warranty

基本情報
起源の場所: 河南、中国
ブランド名: JC
証明: ISO
モデル番号: 4A2
お支払配送条件
パッケージの詳細: 1つの紙箱の1 PC
受渡し時間: 5-8勤務日
支払条件: T/T,D/A,D/P,ウェスタンユニオン,Paypal
供給の能力: 10月額
製品の説明

4A2 Resin Bond Doamond Grinding Wheel Product Description


Product Name: Resin Bond Diamond Grinding Wheel


Product Overview:

 

Resin diamond grinding wheel is a high-performance grinding tool with resin as the binder and diamond abrasive as the cutting body. It combines the ultra-high hardness of diamond and the flexibility of resin binder, and is suitable for high-precision and high-efficiency processing of hard and brittle materials such as ceramics, glass, semiconductors, and cemented carbide.

 

Product Features:

 

High grinding efficiency: Diamond has an extremely high hardness (Mohs hardness 10), which can quickly remove hard and brittle materials.

Good self-sharpening: Resin binders wear moderately, which can continuously expose new abrasive grains and maintain sharpness.

Low grinding temperature: Resin has poor thermal conductivity, but thermal damage can be reduced through pores or coolant.

High surface quality: Suitable for precision machining, reducing chipping or cracks on the workpiece.

Lightweight design: Resin has low density and is suitable for high-speed grinding.

 

Product size(mm):

 

Diameter(D) Thickness(T) Inner hole(H) Abrasive width(W) Abrasive depth(X) Granularity
150 15 20 5 2 D64

 

Of course if you need other sizes , we can  customize for you.

 

Application:

 

Cemented carbide: sharpening and polishing of cutting tools and molds.

Ceramics/glass: precision processing of mobile phone covers and optical lenses.

Semiconductor materials: cutting and grinding of silicon wafers and silicon carbide wafers.

Stone processing: shaping and polishing of marble and granite.

 

Packaging and Shipping:

 

Each CBN grinding wheel is carefully packed in a sealed bag and wrapped with bubble film to prevent scratches or damage during transportation. After packaging, it is placed in a carton and sealed securely with tape. All orders are shipped via reliable couriers. After the order is shipped, we will provide customers with tracking information and estimated delivery time.

 

Competitive Advantages:

 

1.We offer high quality products at competitive price.
2. Shortest delivery time.
3. Flexible payment terms.
4. Timely after-sale service.
5. Most of our equipment can be replaceable with international brands.
6. Our products have been exported to Argentina, Egypt, US, Australia, Romania, Pakistan, Dubai, Abu Dhabi, Iran, India,
Indonesia, Vietnam, Malaysia and many other countries.

 

Resin Bond Diamond Grinding Wheel  4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools 0

 

 

Looking forward to your inquiry!

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